Services
Optoelectronic solutions and customization servicesChip Fabrication
- Lithography
- Metalization, Etching
- Wafer dicing
- Wafer mapping
- Chip binning
Photonic Assembly
- Chip Bonding
- Pick and place
- Wire-Bonding
- Encapsulation
- SMD and TO packaging
Test & Qualification
- Characterization
- Optical, Electrical, Pulsed
- Burn-in and reliability
- Enviromental test
- Supply chain support
Research & Development
- Optical Design
- Mechanical Design
- Electrical Design
- Prototyping
- Product Development
Chip Fabrication
Our chip fabrication services cover all essential stages of processing, from lithography to wafer-level characterization. We work with a wide range of semiconductor materials and advanced process technologies.
Semiconductor Wafer Processing
Processing of 2” to 4” wafers for LEDs, point sources, photodiodes, and monolithic displays using high-quality compound semiconductor materials.
- 2-4” wafer proces: LEDs, point sources, displays
- GaAs / AlGaAs / InGaAs processing
- Photolithography for microstructures
- Wet etch and cleaning
- Metal deposition: Au, Au alloys, Pt, etc.
- Thin film deposition and annealing
Wafer Dicing & Sawing
High-precision dicing ensures minimal edge damage and accurate chip dimensions.
- Down to 250 µm pitch, up to 8” wafers
- Sawing of semiconductor, glass, ceramics
- Thickness of material: 100 µm – 2 mm
- Saw thicknesses between 15 µm – 200 µm
Wafer Mapping
Comprehensive mapping allows us to grade and select dies.
- LED, VCSEL mapping (up to 6”)
- PD dark-current and photo-current mapping
- Fiber-coupled spectrum testing
- Dark current and photocurrent mapping
Chip Sorting and Binning
We ensure accurate binning for intensity, spectral characteristics, and electrical parameters.
- Pre-selection before packaging (SMD, THT)
- LED bins based on CIE 127:2007 standard
- Bluetape and gelpack delivery
Photonic Assembly
Our advanced assembly processes support a wide range of packages—from custom SMD layouts to hermetic TO-cans, multichip assemblies, chip on board, lens integration, and optomechanical customization are available.
Chip Bonding / Pick and Place
We support flexible and high-precision bonding of various chip types and substrates. We place components on indicidual packages or utilizing flexible Chip-ob-Board (CoB) processes.
- Multichip assemblies with 20+ components
- Placement accuracy down to +-10 µm
- Manual and automatic die attach
- Substrates: FR4, flex PCB, IMS (Insulated Metal Substrate), ceramics, TO
- Die Attach Options
- Flip-Chip, CoS (Chip on Submount), eutectic soldering
- Soldering with AuSn preforms or Sn-Ag-Cu alloys
- Vacuum soldering (low and high temp)
Wire-Bonding
Our wire bonding services offer reliability for both high-frequency and high-current applications.
- Manual and automatic machines
- Gold wire: 17 µm / 25 µm / 30 µm
- Ball-wedge and wedge-wedge bonding
- Bumping techniques: Bond Stitch On Ball (BSOB), Safe Bump
- Large automated working area
- Pull and shear testing per MIL standards
Encapsulation
Protective and optical encapsulations are available over a wide spectral range.
- Flat, dam & fill, glob top, lensing encpsulation
- Materials: clear, white, black (light-blocking)
- Phosphor conversion materials for White LEDs or NIR emission
- Custom conversion materials
- AR coatings and optical filters on glass caps (e.g., bandpass)
TO Packaging
Hermetically sealed TO-cans for high-reliability applications and sensor modules.
- Large selection of TO sizes: TO-46, TO-18, TO-39, TO-5, TO-3
- Multichip and multi-element integration
- Custom caps: lens, flat window, AR coating, filters
- Assembly under inert or dry atmosphere (e.g. nitrogen, trimix)
- Optional TEC integration
SMD Packaging
We design and manufacture SMDs to fit standard or custom footprints with a high level of automation.
- Substrate flexibility: FR4, PLCC (Plastic Leaded Chip Carrier) and ceramics
- Flexible encapsulation
- Epoxy and glass lens placement
- 100% automatic testing accroding to CIE 127 norm
- Tape and reel packaging
- Full SMT line: stencil printing, reflow soldering, 8 mm tape feeder
Test and Qualification
We provide full-spectrum testing of optoelectronic components—covering electrical, optical, reliability, and environmental performance.
Enviromental and Lifetime Tests
Ensure long-term reliability of your products through accelerated stress tests.
- Real time power monitoring
- Accelerated aging and reliability tests
- Multi-chip SMD reliability testing
- Humidity and temperature enviroemental test
- Temperature cycling
Manual and Automatic LED testing
All components undergo rigorous electrical and optical testing—automated where possible.
- LED, photo-diode, laser diode characterization
- Electrical and optical properties
- 100% CIE 127 norm compliant testing
- Angular radiation pattern measurements
Pulsed and High-Frequency Studies
We test high-speed and high-current operation characteristics for demanding applications.
- Pulsed measurement (up to 5A)
- High-frequency characterization (kHz–GHz)
Lifetime Product Support
Beyond testing, we support your product throughout its lifecycle.
- Component storage and material tracking
- Inventory and supply chain management
- Qualification services
- Failure analysis
Research, Development and Prototyping
We offer comprehensive R&D services based on our expertise in LED and optoelectronic component manufacturing and packaging, to support the design, prototyping, and development of next-generation optoelectronic products.
Mechanical and Electrical design
We engineer complete solutions, from chip-level design to system integration.
- LED chip selection and configuration
- Custom packaging and enclosure design
- Substrates: PCB, Flex, ceramics
- Material matching and thermal expansion control
- Component specification and BOM (Bill of Materials) optimization
Optical Design
Simulation and optimization of custom optical systems and light sources.
- LED optical system simulation
- Material loss and optical path analysis
- Light conversion materials design and selection
Prototyping
From concept to early-stage production, we enable rapid development of working systems.
- LED-based products design and prototyping
- Small batch production for testing and demonstration
- Series production, qualification
R & D Services
We can support the development of your product in optoelectronics with our experience and ressources. We also proudly participate in collaborative innovation projects and consortia.
- Publicly and privately funded research initiatives
- Joint development with R&D partners
- Commercialization of innovative technologies
- Providing path towards mass manufacturing
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